Samsung is on a streak here. After launching the production of 512GB eUFS 3.0 memory chips, the company is now kick-starting the production of 12GB DRAM modules for usage in smartphones.
They are based on the LPDDR4X standard and use the advanced 10nm (1y-nm) manufacturing process, which has been around since last year. Samsung achieved this by stacking six 16-gigabit LPDDR4X chips into a single compact package that also draws less power. The result is just 1.1mm thick module.
In terms of performance, the package can achieve 34.1 GB/s data transfer rate while maintaining lower power consumption due to the increase in DRAM capacity.
Expect the new chips to make their way into the next-generation high-end smartphones as early as this year.